Multichip Modules with Integrated Sensors Daniel W government and industry research and

government and industry research and development labs

Wie schon im

October 17-18

-- Chapter 35

Von den Geschlechte-Organen

Multichip Modules with Integrated Sensors Daniel W government and industry research andAdvances in electronic devices with higher speeds and complexity have placed higher demands on the electronic packaging of systems. Multichip Modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capabilities have recently evolved to address these new requirements. Under the auspices of the NATO Science Committee an Advanced Research Workshop (ARW) on Multichip Modules with Integrated Sensors was hosted by